JPH076134Y2 - 緩衝包装材 - Google Patents
緩衝包装材Info
- Publication number
- JPH076134Y2 JPH076134Y2 JP1988135563U JP13556388U JPH076134Y2 JP H076134 Y2 JPH076134 Y2 JP H076134Y2 JP 1988135563 U JP1988135563 U JP 1988135563U JP 13556388 U JP13556388 U JP 13556388U JP H076134 Y2 JPH076134 Y2 JP H076134Y2
- Authority
- JP
- Japan
- Prior art keywords
- box
- wall
- pair
- wall surface
- walls
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004806 packaging method and process Methods 0.000 title 1
- 239000006260 foam Substances 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 229920003002 synthetic resin Polymers 0.000 claims description 2
- 239000000057 synthetic resin Substances 0.000 claims description 2
- 239000005022 packaging material Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 9
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical class C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- -1 polypropylene, propylene-ethylene Polymers 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 235000014113 dietary fatty acids Nutrition 0.000 description 4
- 229930195729 fatty acid Natural products 0.000 description 4
- 239000000194 fatty acid Substances 0.000 description 4
- 238000005187 foaming Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000002280 amphoteric surfactant Substances 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- BXOUVIIITJXIKB-UHFFFAOYSA-N ethene;styrene Chemical compound C=C.C=CC1=CC=CC=C1 BXOUVIIITJXIKB-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 150000002191 fatty alcohols Chemical class 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 150000002462 imidazolines Chemical class 0.000 description 1
- 229920000092 linear low density polyethylene Polymers 0.000 description 1
- 239000004707 linear low-density polyethylene Substances 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229940083254 peripheral vasodilators imidazoline derivative Drugs 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 150000003222 pyridines Chemical class 0.000 description 1
- 150000003856 quaternary ammonium compounds Chemical class 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
Landscapes
- Buffer Packaging (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988135563U JPH076134Y2 (ja) | 1988-10-18 | 1988-10-18 | 緩衝包装材 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988135563U JPH076134Y2 (ja) | 1988-10-18 | 1988-10-18 | 緩衝包装材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0256175U JPH0256175U (en]) | 1990-04-24 |
JPH076134Y2 true JPH076134Y2 (ja) | 1995-02-15 |
Family
ID=31395303
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988135563U Expired - Lifetime JPH076134Y2 (ja) | 1988-10-18 | 1988-10-18 | 緩衝包装材 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH076134Y2 (en]) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007210665A (ja) * | 2006-02-13 | 2007-08-23 | Kitagawa Ind Co Ltd | 緩衝材、および電子機器内部の緩衝構造 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6520337B2 (en) * | 2000-01-24 | 2003-02-18 | Forrest Smith | Unitary product cushioning structure |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60154278U (ja) * | 1984-03-23 | 1985-10-15 | 株式会社 ウエノ包装 | 包装用緩衝材 |
JPS60228274A (ja) * | 1984-04-17 | 1985-11-13 | 三菱電機株式会社 | 磁気デイスク記憶装置の梱包構造 |
-
1988
- 1988-10-18 JP JP1988135563U patent/JPH076134Y2/ja not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007210665A (ja) * | 2006-02-13 | 2007-08-23 | Kitagawa Ind Co Ltd | 緩衝材、および電子機器内部の緩衝構造 |
Also Published As
Publication number | Publication date |
---|---|
JPH0256175U (en]) | 1990-04-24 |
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